Position:Back Grind SAW Senior Engineer
Location:Dong Guan
Emp TypeFull Time

   Responsibilities
.
-  Back grind and Wafer Saw Process Improvement(Quality & yield & cost reduction & UPH)
    
-  Back grind and Wafer Saw daily quality case analysis and follow up
    
-  Back grind and Wafer Saw Engineering & qualification lot follow up
    
-  Document Spec review and continue optimization
    
-  Interaction with other departments and customers.
    
-  Provide support on new project introduction

   Requirements
.
-  >2 years working experience in Back grind, laser groove, wafer saw process
    
- Familiar with DGP 8760 or 8560 grinder/DFL7160 or 7161 laser saw/ DFD6361 or 6362 wafer saw equipment.
    
-  Advanced in Microsoft office tool(PPT/Word/Excel)
    
- Fluent in spoken & good command in written English.
    
-  Strong knowledge in 8D report, PFMEA, Control Plan, Process spec, DOE.
    
-  Strong data analysis skill, SPC.


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